Jet Propulsion Laboratory Electronic Packaging Engineer III in Pasadena, California


Jet Propulsion Laboratory


Requisition ID 2016-7636

Posted Date
11/29/2016

Discipline Description
Mechanical

Scheduled Hours
40

Hiring Organization
356B - ELECTRONIC PACKAGING ENGINEERING

Education
Bachelor's

Travel
No

LinkedIn
#LI-JH1

Clearance Options
None

Job Locations
US - CA - Pasadena


Category
Engineering

Career Level
Level 3

Relocation Eligibility
No

Minimum Years of Experience
6

Work Authorization
Ability to Obtain Work Authorization

Clearance Status
None


Overview:

Do you excel in an environment that values exploration and discovery? We have a universe of opportunities waiting for you!



The Jet Propulsion Laboratory (JPL) is NASA's lead center for robotic exploration of the solar system. Our core competency is the end-to-end implementation of unprecedented robotic space missions to study Earth, the Solar System, and the Universe.



JPL, located in Pasadena, California, has a casual, campus-like environment situated on 177 acres in the foothills of the San Gabriel Mountains and offers a work environment unlike any other: we inspire passion, foster innovation, build collaboration, and reward excellence.




We are proud to be part of NASA and Caltech, as we explore the universe and make history through new discoveries.



We aim to do things never done before and to go places few can go. We dare mighty things...do you?



Responsibilities:

This unique opportunity is part of the Mechanical Systems Engineering, Fabrication and Test Division which engages in research, technology development, and the creation of advanced mechanical, thermal, propulsion, and electronic packaging systems with expertise that spans the full breath of mechanical disciplines and is applied from architectural concept development through operations.


As the Electronic Packaging Engineer you will be working for JPL's Electronic Manufacturing, Packaging, & Technical Services Section, which provides engineering services that include the following: fabrication of electronics (boards and cables/harnesses), microelectronic and photonic hardware; electronic packaging, manufacturing engineering and electronic hardware thermal/structural analysis; advanced electronic packaging engineering, technology development and process engineering; technical facilities management and cleanroom services/certification; custom measurement systems development and instrumentation services; calibration services, test equipment loan pool and metrology engineering, and technical inventory management, cryogenics services and Flight Hardware Logistics Program (FHLP).

  • Design updates and drawing releases on all projects.
  • Design, build, assembly and test (iBAT) processes to fabricate and assemble packaging and cable harness designs.
  • Interface with machine shop for delivery of mechanical hardware and quality assurance to develop solutions to resolve discrepancies with hardware fabrication.
  • Work independently and lead teams in solving complex packaging and cable harness problems.
  • Demonstrate flexibility in handling work assignments.
  • Define and scope tasks and acquire resources to complete a task on time and budget.
  • Lead design teams in a collaborative environment to design, develop support equipment for the project and research applications.
  • Lead design reviews.
  • Interface with engineers, designers, analysts, machine shop, and project staff.
  • Work independently and under the direction of the group supervisor, project management, technical leads, and proposal managers as required.


Qualifications:

  • Bachelor's degree in Mechanical Engineering or related technical discipline with a minimum of 6 years of related experience; Masters degree in similar disciplines with a minimum of 4 year of related experience; PhD with 2 years of related experience.
  • Advanced knowledge in computer aided engineering (CAD) using tools such as Unigraphics NX, Solidworks, Autocad .
  • Extensive understanding and wide application of principles, theories, concepts and techniques in mechanical design, ability to solve packaging engineering mechanical design problems, perform trade studies, develop design requirements, perform piece part design and coordinate fabrication, assembly, and qualification of hardware.
  • Advanced knowledge of applicable industry and/or academic practices and standards in mechanical systems including structures, configuration, electronic packaging, structural analysis and integration and test.
  • Advanced knowledge in one or more related fields of the following areas: design of printed wiring boards and electronic enclosure/chassis, manufacturing and assembly of printed wiring boards and cable harnesses.
  • Advanced knowledge of applicable industry and/or academic practices and standards in drawing requirements, drawing processes and inspection reports.
  • Extensive experience interfacing with various suppliers and services including printed wiring board and mechanical fabrication, electronic assembly, project representatives and mission assurance.
  • Advanced understanding and application of standard principles, theories, concepts and techniques in soldering operations, cable assembly and surface mount technology electronics manufacturing.
  • Advanced knowledge of design, build, assembly and test (iBAT) process.
  • Advanced written and verbal communication skills and organizational skills.
  • Must be able to work in a team environment and meet deadlines.

Desired Skills:

  • Broad knowledge of applicable Laboratory policies and procedures, NASA policies and procedures, and government regulations.
  • Broad knowledge in Mechanical Analysis tool (FEM).
  • Experience with spacecraft flight hardware development and test.
  • Experience with Printed Wiring Board (PWB) design tools such as Mentor or Altium.
  • Experience with Cable design, assembly and test
  • Desire a candidate who is assertive, self-motivated and can work with minimal direction.
  • Working Knowledge of the JPL drawing release process and inspection reports.
  • Working knowledge of the JPL Instruction, build, assembly and test ( iBAT) process.
  • Working knowledge in Unigraphics NX or Solidworks.




Caltech/JPL is an Equal Employment Opportunity (EEO) and affirmative action employer. It is the policy of Caltech/JPL to provide equal employment opportunities, actively recruit, and include for employment consideration all qualified applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, protected veteran or disabled status, or genetic information.

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